I wasn’t sure how to decap it at first because I’m used to working with ICs encapsulated in standard black epoxy-glass molding compounds. I thought briefly about chemical methods, grinding, and machining before coming across MIL-STD-1580D section 12, which called for grinding or machining through most of the metal lid, thinning it down to the point that a handheld blade can make the final cut.
NASA猎户座飞船阿尔忒弥斯二号实时影像。谷歌浏览器是该领域的重要参考
Steven McIntoshEntertainment reporter，详情可参考豆包下载
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